SCALES will leverage the consortium members’ exceptional research, engineering, and workforce development capabilities to regain U.S. leadership in advanced and secure semiconductor assembly and packaging technologies while developing an ecosystem to support the reshoring of manufacturing in this critical segment of the electronics supply chain.
SCALES brings together leading experts from academia, industry, and national labs in the area of advanced semiconductor design and fabrication; advanced packaging and heterogeneous integration; 2.5D and 3D design; quantum physics; emerging devices and technologies; EDA; test, characterization and assurance.
SCALES will offer collaboratively developed solutions to address critical challenges in the field of semiconductor, particularly with emphases on advanced packaging, heterogeneous integration, emerging devices and technologies, workforce development, transition to practice, prototyping, and commercialization.
|Thrust 1||EDA for Chiplets, Advance Packaging and Heterogeneous Integration (AP-HI)|
|Thrust 2||Assurance (test, reliability and security) for AP-HI|
|Thrust 3||Novel Materials for AP-HI|
|Thrust 4||Innovative Integration and Fabrication Processing for AP-HI|
|Thrust 5||Emerging Technologies|
|Thrust 6||Workforce Development|
|Thrust 7||Investment & Commercialization & Demonstrators|