“Don’t Forget the Package: Establishing Domestic Heterogeneous Integration Capability”
Thursday, March 2 at 1:00pm
Delivered Via Zoom
The recent passage of the CHIPS legislation has initiated a new era of semiconductor technology growth in the United States, with the goal of re-establishing advanced domestic microelectronics manufacturing to support both commercial and government applications. While much of the focus in the re-shoring discussion has been on leading edge foundry capability, heterogeneous integration (HI) and advanced packaging (AP) technologies are critically important in establishing a complete ecosystem to support domestic microelectronics. As HI architectures are viewed as crucial enablers for next generation microsystems to maintain performance improvements that are difficult and costly to achieve through foundry node advancement, establishing these technologies onshore will be a priority. This presentation will discuss details around this unique opportunity to establish a comprehensive domestic integration and packaging manufacturing capability and SkyWater’s efforts to establish an open foundry model to support interposer fabrication, FOWLP, and hybrid bonding technologies.
Alan Huffman is Senior Director for the heterogeneous integration business unit at SkyWater Technologies where he is responsible for strategic business development, technology platform direction, and market alignment. Over the course of 27+ years in the advanced packaging industry he has held previous positions as Director of Engineering for Micross Advanced Interconnect Technology, Sr. Research Engineer and Program Manager at RTI International, and Member of Technical Staff at MCNC Research & Development Institute. He received the B.S degree in physics from The University of North Carolina at Chapel Hill in 1994. His technical focus has been heterogeneous integration and advanced interconnect technologies throughout his career and has authored or co-authored numerous papers and presentations in these areas.
Charles G. Woychik is the Director of Advanced Packaging Platforms at SkyWater Technology in Kissimmee, FL. Previously he was the Chief Scientist at i3 Microsystems in St. Petersburg, FL. He was the Senior Director of 3D Technology at Invensas Corporation and was a Senior Scientist at GE’s Global Research Center. He began his career at IBM Endicott, NY where he held both engineering and managerial positions. His area of expertise is materials and processes for electronics packaging. He holds a Doctorate and Master of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor of Science degree in Metallurgical Engineering from the University of Wisconsin-Madison. Chuck has presented at numerous conferences and has many publications. He has 123 issued US issued patents to his credit.