Panel 2: Workforce Development for Heterogeneous Integration & Packaging
Friday, April 14
11:00am – 12:30pm ET
Join via Zoom
Meeting ID: 929 6289 9215
Passcode: 760137
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Abstract
The goal of this series of workforce-development panel discussions, which is organized around four different technology areas of microelectronics, is to examine the current workforce-development landscape, challenges, and paths forward in each technology area. To do this we bring together experts across many disciplines, applications and perspectives to share their viewpoints, answer questions, debate approaches, and possibly find mutually beneficial solutions.
Panelists
- Eric Breckenfeld, SIA
- Najme Ebrahimi, UF
- Kevin Hoopingarner, Renesas
- Walter Kocon, Global Foundries
- Len Orlando, Ansys
- Todd Younkin, SRC
Moderator: Jack Judy, UF