The fourth virtual workforce development panel discussion is Friday, May 12 at 11:00am ET. The panel will focus on workforce development for AI/ML hardware.
The second of four virtual panel discussions, focusing on workforce development for heterogeneous integration and advanced packaging, is Friday, April 14 at 11:00am via Zoom.
Alan Huffman is senior director for the heterogeneous integration business unit at SkyWater Technologies and Charles G. Woychik is the director of advanced packaging platforms, both at SkyWater Technology in Kissimmee, FL. They both present “Don’t Forget the Package: Establishing Domestic Heterogeneous Integration Capability” Thursday, March 2 at 1:00pm.
SCALES is holding a day-long meeting to prepare for a response to the first CHIPS Notice of Funding Opportunity (NOFO) focusing on Commercial Fabrication Facilities.
The meeting is scheduled for Monday, April 10 at BRIDG in Kissimmee (near Orlando), from 10:00am to 5:00pm.
Florida Semiconductor Week, Jan. 23–25 in Gainesville, brought together nearly 300 luminaries in the world of semiconductor manufacturing and research to discuss the state-of-the-art in advanced packaging, advanced semiconductor design, and fabrication.